Semiconductor device and a method of manufacturing the same

ABSTRACT

A CF card ( 1 ) comprises: a casing constituted by two panel plates ( 2, 2 ) and a frame ( 3 ); and a printed wiring board ( 4 ) accommodated in the casing. A plurality of claw-like engaging parts ( 5 ) are provided to the peripheries of the panel plates ( 2 ). When the CF card ( 1 ) is assembled, the engaging parts ( 5 ) of the first panel plate ( 2 ) are inserted into through holes of a long groove ( 8 ) provided in the frame ( 3 ) and then the printed wiring board ( 4 ) is mounted on the panel plate ( 2 ) located at the inside of the frame ( 3 ). Thereafter, the engaging parts ( 5 ) of the second panel plate ( 2 ) are inserted into the through holes of the long groove ( 8 ) from the surface located in the opposite side of the frame ( 3 ). There are two types of engaging parts ( 5 ): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts ( 5 ) of one panel plate ( 2 ) are inserted into the holes of the engaging parts ( 5 ) of the other panel plate ( 2 ).

TECHNICAL FIELD OF THE INVENTION

[0001] The present invention relates to a semiconductor device and amethod of manufacturing the same, and, more particularly, to a techniqueeffectively applied to a memory card.

BACKGROUND OF THE INVENTION

[0002] A memory card is a card-type semiconductor device mounting asemiconductor chip in which a memory LSI for data storage or programstorage is formed, and is connected to various kinds of electronicequipments such as a digital camera, a handheld PC, an audio recorderand the like when in use.

[0003] The memory card belonging to these kinds has a structure in whicha printed wiring board on which the above-mentioned semiconductor chipis mounted is accommodated in a casing (case). However, from a securitystandpoint, it is required that the casing has such a rigid structure asnot to be easily disassembled.

[0004] Meanwhile, in the case of a memory card for data storage inparticular, the low cost thereof is required as one high priority.Therefore, the reduction in the manufacturing cost must be achieved byreducing the number of components of the casing to the utmost and bypromoting the automation of assembly thereof.

[0005] However, the conventional memory card has had problems of thefact that equipment investment for the assembly thereof becomesexpensive and the manufacturing cost is difficult to reduce in order torequire a special apparatus such as an ultrasonic welding machine or thelike in the assembly thereof.

[0006] An object of the present invention is to provide a memory cardhaving high reliability by low manufacturing cost.

[0007] The above and other objects and novel characteristics of thepresent invention will be apparent from the description of thisspecification and the accompanying drawings.

SUMMARY OF THE INVENTION

[0008] The typical ones of the inventions disclosed in the presentapplication will be briefly described as follows.

[0009] A semiconductor device according to the present inventioncomprises a casing constituted by a frame having a plurality of throughholes penetrating through both surfaces thereof, a first panel plateattached to one surface of said frame, and a second panel plate attachedto the other surface of said frame, a printed wiring board on which asemiconductor chip is mounted being accommodated in said casing,

[0010] wherein a plurality of engaging parts each having a lance or ahole are formed on the peripheries of said first and second panelplates, respectively, and

[0011] said engaging parts formed on said first panel plate and saidengaging parts formed on said second panel plate are inserted into saidplurality of through holes formed in said frame, and said lance providedin each of one plurality of engaging parts is inserted into said holeprovided in each of the other plurality of engaging parts.

[0012] A method of manufacturing a semiconductor device according to thepresent invention comprises the steps of:

[0013] (a) preparing a frame having a plurality of through holespenetrating through both surfaces thereof, and first and second panelplates in which a plurality of engaging parts each provided with a lanceor a hole in the peripheries thereof is respectively formed, and aprinted wiring board on which a semiconductor chip is mounted;

[0014] (b) pressing said engaging parts formed on-said first panel plateinto said through holes formed in said frame, thereby attaching saidfirst panel plate to one surface of said frame;

[0015] (c) mounting said printed wiring board to said frame to whichsaid first panel plate is attached; and

[0016] (d) after said step (c), pressing said engaging parts formed onsaid second panel plate, into said through holes formed in said frame,and inserting said lance each provided in one of said engaging partsformed on said first panel plate and said engaging parts formed on saidsecond panel plate, into said hole each provided in the others, therebyattaching said second panel plate to the other surface of said frame.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017]FIG. 1A is a perspective view showing the appearance of asemiconductor device that is an embodiment of the present invention.

[0018]FIG. 1B is a perspective view showing the appearance of asemiconductor device that is an embodiment of the present invention.

[0019]FIG. 2 is an exploded perspective view of a semiconductor devicethat is an embodiment of the present invention.

[0020]FIG. 3 is a perspective view showing a panel plate of asemiconductor device that is an embodiment of the present invention.

[0021]FIG. 4 is an enlarged view of an engaging part provided on a panelplate of a semiconductor device that is an embodiment of the presentinvention.

[0022]FIG. 5 is a perspective view showing a frame of a semiconductordevice that is an embodiment of the present invention.

[0023]FIG. 6 is a plan view showing a frame of a semiconductor devicethat is an embodiment of the present invention.

[0024]FIG. 7 is a perspective view showing a printed wiring board of asemiconductor device that is an embodiment of the present invention.

[0025]FIG. 8 is a perspective view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0026]FIG. 9 is a perspective view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0027]FIG. 10 is a perspective view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0028]FIG. 11 is a perspective view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0029]FIG. 12 is a perspective view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0030]FIG. 13 is a perspective view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0031]FIG. 14 is a perspective view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0032]FIG. 15 is a perspective view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0033]FIG. 16 is a plan view illustrating a method of manufacturing asemiconductor device that is an embodiment of the present invention.

[0034]FIG. 17A is a cross-sectional view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0035]FIG. 17B is a cross-sectional view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0036]FIG. 18 is a plan view illustrating a method of manufacturing asemiconductor device according to an embodiment of the presentinvention.

[0037]FIG. 19A is a cross-sectional view illustrating a method ofmanufacturing a semiconductor device that is an embodiment of thepresent invention.

[0038]FIG. 19B is a front view.

[0039]FIG. 20 is a plan view illustrating a method of manufacturing asemiconductor device that is an embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0040] In the following, embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings.Components having the same function are denoted by the same referencesymbols through all the drawings for describing the embodiments, and therepetitive description thereof will be omitted.

[0041] A semiconductor device in this embodiment is a Compact Flash(registered trademark of SanDisk Corporation in U.S.A.) Card(hereinafter, referred to as a CF card simply), which meets CFA (CompactFlash Association) standards. FIGS. 1A and 1B are perspective viewsshowing the appearance of a CF card type I, wherein FIG. 1A is a viewshown with a connector 9 located in a front side and FIG. 1B is a viewshown on the condition that a side opposite to the connector 9 islocated in a front side. In addition, FIG. 2 is an exploded perspectiveview of the CF card.

[0042] As shown in the drawings, the components of the CF card 1 are: acasing constituted by two panel plates 2 and 2 and a frame 3; and aprinted wiring board 4 accommodated in this casing. Outer dimensions ofthe casing are length×width=36.4 mm×42.8 mm and height=3.3 mm.

[0043]FIG. 3 is a perspective view of the two panel plates 2 and 2.These panel plates 2 and 2 are composed of thin plates made of stainlesssteel (SUS 304) and each having the same shape. An embossing treatmentis performed to the surface side of each panel plate 2, and sofingerprints or the like are not easily attached thereto. Also, aplurality of claw-like engaging parts 5 are provided on the periphery ofeach panel plate 2.

[0044] Respective engaging parts 5 are integrally formed on each panelplate 2. Although not particularly limited, five engaging parts 5 areprovided in each of both sides thereof and one engaging part 5 isprovided in each of both ends of the connector 9 side and six engagingparts 5 are provided in a side opposite thereto. Thus, a total ofeighteen engaging parts 5 are provided. Each of the engaging parts 5 hastensile strength enough to bear a load of 1 Kgf or more.

[0045] As shown in the enlarged view of FIG. 4, there are two types ofengaging parts 5, that is, one having a lance 6 and the other having ahole 7. The engaging parts 5 each having the lance 6 and the engagingparts 5 each having the hole 7 are alternately arranged along theperipheries of the respective panel plates 2 and 2. As described later,in the assembly of the CF card 1, each lance 6 of the engaging parts 5on one panel plate 2 is inserted into each hole 7 of the engaging parts5 on the other panel plate 2.

[0046]FIG. 5 is a perspective view of the frame 3, and FIG. 6 is a planview of the same. The frame 3 has an outline formed in an approximateU-shape, and is constituted by integrally molding a resin having goodmoldability, for example, PBT (Polybutylene telephthalate) containing15% of glass fiber, or the like. Also, an embossing treatment isperformed to the outer surface of the frame 3, such that fingerprints orthe like are not easily attached thereto and sinks caused due to theinjection molding thereof are made inconspicuous.

[0047] A long groove 8 to which the periphery of each panel plate 2 isfitted is provided in each of the upper and lower surfaces of the frame3. Further, through holes 10 into which the engaging parts 5 of eachpanel plate 2 are inserted are provided in the long groove 8.

[0048]FIG. 7 is a perspective view of the printed wiring board 4. Theprinted wiring board 4 is constituted by forming Cu wirings (not shown)on the surface of, for example, a plate made of epoxy resin containingglass fiber (glass epoxy), and packages 11 are mounted on the mainsurface thereof. In each package 11, a semiconductor chip (not shown) inwhich a flash memory for data storage is formed is sealed. Further, theconnector 9 for connecting the CF card 1 to various electronicequipments such as a digital camera, a handheld PC, an audio recorderand the like is attached to one side of the printed wiring board 4. Inthe case of the CF card type I, the interface of the connector 9 hasfifty pins.

[0049] As described above, in the CF card 1 according to thisembodiment, the casing for accommodating the printed wiring board 4 isconstituted by an extremely small number of components, that is, twopanel plates 2 and 2 each having the same shape and one frame 3.

[0050] Next, an assembly method of the CF card 1 constituted in theabove-described manner will be described with reference to FIGS. 8 to20.

[0051]FIG. 8 is a perspective view showing a part of a hoop material 20having a multiple series of panel plates 2. Each of the panel plates 2is supported by carriers 21 via notches 22 provided at the four cornersthereof. In the drawings, almost three panel plates 2 are illustrated.However, since the hoop material 20 has actually a multiple series ofabout one thousand panel plates 2, it is wound on a reel or the like andis stored in this state.

[0052] The CF card 1 is assembled, for example, by: inserting theengaging parts 5 of each panel plate 2, into the through holes 10 (seeFIG. 6) formed in the long groove 8 provided in the frame 3 as shown inFIG. 9; then mounting the printed wiring board 4 on the panel plate 2located at the inside of each frame 3 as shown in FIG. 10; andthereafter inserting the engaging parts 5 of the panel plate 2 locatedin a second hoop material 20, into the through holes 10 formed in thelong groove 8 from the surface of a opposite side of the frame 3 asshown in FIG. 11.

[0053] As shown in FIG. 12, attachment of the panel plate 2 to the frame3 can also be made after the plate 2 is separated from the hoop material20. As a jig for attaching the panel plate 2 to the frame 3, forexample, as shown in FIG. 13, the jig can also be used which has areceiving table 32 provided with four walls 31 and restricting theposition of the frame 3, and a punch 33 having an area almost equal tothat of the panel plate 2.

[0054] In this case, the frame 3 is firstly positioned at each inside ofthe walls 31 of the receiving table 32, and thereafter the engagingparts 5 of the separated panel plate 2 are pressed into the throughholes 10 of the frame 3 by using the punch 33. At this time, since thepressed load is 1 Kg or less per engaging part 5, each engaging part 5can be easily pressed thereinto.

[0055] Next, as shown in FIG. 14, the printed wiring board 4 is mountedon the panel plate 2 attached to the frame 3. Thereafter, the fournotches 22 connecting the panel plate 2 and the carrier 21 are cut outas shown in FIG. 15. In this case, for example, by providing a halfcut23 in a part of each notch 22 in advance as shown in FIG. 16 and bypushing each notch 22 with using a eyeleteer 24 or the like to drop thenotch into the long groove 8 of the frame 3 as shown in FIGS. 17A and17B, the notches 22 can be easily cut out.

[0056] Next, as shown in FIG. 18, the other panel plate 2 is attached tothe surface of an opposite side of the frame 3 with using the jig shownin FIG. 13, or the like.

[0057]FIG. 19A is a cross-sectional view showing a engaging state of thetwo panel plates 2 and 2 attached to the frame 3, and FIG. 19B is afront view showing the same.

[0058] The panel plates 2 and 2 are attached by using theabove-described pushing jig, that is, by: pressing the engaging parts 5and 5 of the panel plates 2 and 2 into the through holes 10 of the frame3 from above and below; and inserting the lances 6 of the engaging parts5 of one panel plate 2 into the corresponding holes 7 of the engagingparts 5 of the other panel plate 2.

[0059] As shown in the drawings, the engaging parts 5 are bent so thateach lance 6 thereof can be located at an inner position and each hole 7thereof can be located at an outer position. Therefore, there occur nogaps between the engaging parts 5 and the inner walls of the throughholes 10. Thus, the lances 6 is easily inserted into the holes 7 bysimply pressing the engaging parts 5 and 5 of the panel plates 2 and 2into the through holes 10, and once the lances 6 are inserted into theholes 7, the panel plates 2 and 2 are not detached from each other evenif pulled from the outside.

[0060] Also, in each of the panel plates 2 and 2, the engaging parts 5each having the lance 6 and the engaging parts 5 each having the holes 7are alternately arranged, and the number of the lances 6 and that of theholes 7 are equal to each other in the respective panel plates 2 and 2.Therefore, it is possible to evenly press the engaging parts 5 and 5 ofthe panel plates 2 and 2 thereinto.

[0061] As described above, the CF card 1 according to this embodimenthas characteristics of the fact that the panel plates having once beenassembled are extremely difficult to disassemble because the panelplates 2 and 2 have a rigidly engaging structure, and that high securityis obtained because the engaging parts 5 are significantly deformed whenthe panel plates 2 are forcibly and strongly pulled from the outside andbecause traces caused by the pull are inevitably left.

[0062] Also, the CF card 1 according to this embodiment hascharacteristics of the fact that since the rigidly engaging structure isobtained by simply pressing the engaging parts 5 and 5 of the two panelplates 2 and 2 into the through holes 10 of the frame 3 with using thesimple pushing jig, special apparatus such as an ultrasonic weldingmachine or the like is not required and it is possible to reduce thecost of the equipment investment for the assembly.

[0063] As shown in FIG. 20, after the first panel plate 2 is insertedinto the frame 3, the second panel plate 2 can also be insertedthereinto before each panel plate 2 is separated from the hoop material20.

[0064] In this case, the frame 3 in which the first panel plate 2 hasbeen inserted is first carried to a right-hand stage, and then thesecond panel plate 2 is inserted into the frame in which the first panelplate 2 has been inserted. Thereafter, the frame 3 is lifted by thecarrier 21 and carried to a left-hand stage, and then the second panelplate 2 is separated from the carrier 21 by cutting the notches 22. Itis also possible that the hoop material 20 together with the frame 3 iswound on a reel after the insertion of the second panel plate 2 into theframe 3 at the right-hand stage, and then is delivered to a maker, and,at the time, the second panel plate 2 is separated from the carrier 21.

[0065] Thus, the automation of the assembly can be easily attained invarious manners by forming a multiply series of the panel plates 2.Therefore, the reduction in the assembly cost and in the lead time canbe achieved.

[0066] In the foregoing, the inventions made by the inventors thereofhave been described in detail based on the embodiments. However,needless to say, the present invention is not limited to theabove-mentioned embodiments, and can be variously changed and modifiedwithout departing from the gist thereof.

[0067] In the foregoing embodiments, the case where the presentinvention is applied to the CF card type-I has been described. However,needless to say, the present invention can be applied to the CF cardtype-II having a casing with a thickness of 5 mm. Further, theengagement structure of the panel plates according to the presentinvention can be applied not only to the CF card in which the interfaceof the connector has sixty-eight pins but also to various memory cardssuch as a PC card or the like.

INDUSTRIAL APPLICABILITY

[0068] The semiconductor device according to the present invention isconstituted by a small number of components and so can be assembledsimply. Therefore, by applying to the memory card connected to variouselectronic equipments such as a digital camera, a handheld PC, an audiorecorder and the like, the manufacturing cost thereof can be reduced.

What is claimed is:
 1. A semiconductor device comprising: a casingconstituted by a frame having a plurality of through holes penetratingthrough both surfaces thereof, a first panel plate attached to onesurface of said frame, and a second panel plate attached to the othersurface of said frame, a printed wiring board on which a semiconductorchip is mounted being accommodated in said casing, wherein a pluralityof engaging parts each having a lance or a hole are formed on theperipheries of said first and second panel plates, respectively, andsaid engaging parts formed on said first panel plate and said engagingparts formed on said second panel plate are inserted into said pluralityof through holes formed in said frame, and said lance provided in eachof one plurality of engaging parts is inserted into said hole providedin each of the other plurality of engaging parts.
 2. The semiconductordevice according to claim 1, wherein said first panel plate and saidsecond panel plate each have the same shape, and the engaging parts eachhaving said lance and the engaging parts each having said hole arealternately arranged in said first and second plates.
 3. Thesemiconductor device according to claim 1, wherein said lance is bent soas to be located at an inner position of said frame and said hole isbent so as to be located at an outer position of said frame.
 4. Thesemiconductor device according to claim 1, wherein said engaging partsare integrally formed with said panel plates.
 5. The semiconductordevice according to claim 1, wherein said frame is formed by integrallymolding a resin.
 6. The semiconductor device according to claim 1,wherein an embossing treatment is performed to each outer surface ofsaid first and second panel plates.
 7. The semiconductor deviceaccording to claim 1, wherein an embossing treatment is performed to anouter surface of said frame.
 8. The semiconductor device according toclaim 1, wherein a semiconductor chip in which a flash memory is formedis mounted on said printed wiring board.
 9. A method of manufacturing asemiconductor device comprising the steps of: (a) preparing a framehaving a plurality of through holes penetrating through both surfacesthereof, and first and second panel plates in which a plurality ofengaging parts each provided with a lance or a hole in the peripheriesthereof is respectively formed, and a printed wiring board on which asemiconductor chip is mounted; (b) pressing said engaging parts formedon said first panel plate into said through holes formed in said frame,thereby attaching said first panel plate to one surface of said frame;(c) mounting said printed wiring board to said frame to which said firstpanel plate is attached; and (d) after said step (c), pressing saidengaging parts formed on said second panel plate, into said throughholes formed in said frame, and inserting said lance each provided inone of said engaging parts formed on said first panel plate and saidengaging parts formed on said second panel plate, into said hole eachprovided in the other, thereby attaching said second panel plate to theother surface of said frame.
 10. The method of manufacturing asemiconductor device according to claim 9, wherein the attachment ofsaid first panel plate to said frame in said step (b) is made after saidfirst panel plate is separated from a hoop material having a multiplyseries of panel plates.
 11. The method of manufacturing a semiconductordevice according to claim 9, wherein the attachment of said second panelplate to said frame in said step (d) is made by using a hoop materialhaving a multiply series of panel plates, and thereafter said secondpanel plate is separated from said hoop material.
 12. The method ofmanufacturing a semiconductor device according to claim 9, wherein thestep of attaching said first and second panel plates to said framecomprises the steps of: preparing a pushing jig which includes areceiving table having a means of restricting the position of said frameand a punch having an area almost equal to those of said first andsecond panel plates; and positioning said frame at said receiving tableof said pushing jig, and thereafter pressing said engaging parts formedon said first and second panel plates, into said through holes formed insaid frame, by using said punch.